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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays . 1/31 datashee t tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 14? 001 www.rohm.com 14.mar.2013 rev.003 single-output ldo regulators ultra low quiescent current ldo regulator bd7xxl2efj/fp/fp2/fp3-c general description the bd7xxl2efj/fp/fp2/fp3-c are low quiescent regulators featuring 50v absolute maximum voltage, and output voltage accuracy of 2%, 200ma output current and 6 a (typ.) current consumption. there regulators are therefore ideal for applications requiring a direct connection to the battery and a low current consumption. ceramic capacitors can be used for compensation of the output capacitor phase. furthermore, these ics also feature overcurrent protection to protect the device from damage caused by short-circuiting and an integrated thermal shutdown to protect the device from overheating at overload conditions. features ? ultra low quiescent current: 6 a (typ.) ? output current capability: 200ma ? output voltage: 3.3 v or 5.0 v(typ.) ? high output voltage accuracy: 2% ? low saturation voltage by using pmos output transistor. ? integrated overcurrent pr otection to protect the ic from damage caused by output short-circuiting. ? integrated thermal shutdown to protect the ic from overheating at overload conditions. ? low esr ceramic capacitor can be used as output capacitor. ? htsop-j8, to252-3, to263-3f, sot223-4f 4type package key specification ? ultra low quiescent current: 6 a (typ.) ? output voltage: 3.3 v or 5.0 v (typ.) ? output current capability: 200ma ? high output voltage accuracy: 2% ? low esr ceramic capacitor can be used as output capacitor packages w (typ.) x d (typ.) x h (max.) ? efj: htsop-j8 4.90mm x 6.00mm x 1.00mm ? fp: to252-3 6.50mm x 9.50mm x 2.50mm ? fp2: to263-3f 10.16mm x 15.10mm x 4.70mm ? fp3: sot223-4f 6.53mm x 7.00mm x 1.80mm a pplic ations ? automotive (body, audio system, navigation system, etc.) typical application circuits ? components externally connected: 0.1 f cin, 4.7 f cout (typ.) *electrolytic, tantalum and ceramic capacitors can be used. figure 2. typical application circuits figure 1. package outlook htsop-j8 to252-3 to263-3f sot223-4f 1:vcc 2:n.c. 3:vout fin bd7xxl2fp-c
datasheet datasheet . 2/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 ordering information b d 7 x x l 2 e f j - c e 2 lineup output current ability output voltage (typ.) package type orderable part number 200 ma 3.3 v htsop-j8 bd733l2efj-ce2 to252-3 bd733l2fp-ce2 to263-3f bd733l2fp2-ce2 sot223-4f bd733l2fp3-ce2 5.0 v htsop-j8 BD750L2EFJ-CE2 to252-3 bd750l2fp-ce2 to263-3f bd750l2fp2-ce2 sot223-4f bd750l2fp3-ce2 package efj: htsop-j8 fp: to252-3 fp2: to263-3f fp3: sot223-4f taping e2: reel-wound embossed tamping output voltage 33: 3.3v 50: 5.0v
datasheet datasheet . 3/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 pin configuration figure 3. pin configuration pin description pin no. pin name function 1 vout output pin 2 n.c. not connected 3 n.c. not connected 4 n.c. not connected 5 gnd gnd 6 n.c. not connected 7 n.c. not connected 8 vcc supply voltage input pin pin no. pin name function 1 vcc supply voltage input pin 2 n.c./gnd to252-3: n.c. to263-3f, sot223-4f: gnd 3 vout output pin fin gnd gnd htsop-j8 ( n.c. terminals are not need to connect to gnd. ( exposed die pad is need to be connected to gnd.) ( n.c. terminals are not need to connect to gnd.) to252-3, to263-3f, sot223-4f htsop-j8 (top view) to252-3 (top view) to263-3f (top view) sot223-4f (top view) 1 2 3 4 8 7 6 5 1 2 3 fin 1 2 3 1 23
datasheet datasheet . 4/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 block diagram htsop-j8 to252-3, to263-3f, sot223-4f figure 4. block diagram
datasheet datasheet . 5/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 absolute maximum ratings ta=25c parameter symbol ratings unit supply voltage *1 vcc -0.3 to +50.0 v power dissipation htsop-j8 *2 pd 0.75 w to252-3 *2 pd 1.3 w to263-3f *2 pd 1.9 w sot223-4f *2 pd 0.6 w operating temperature range topr -40 to +125 c storage temperature range tstg -55 to +150 c maximum junction temperature tjmax 150 c *1 pd should not be exceeded. *2 htsop-j8 mounted on 114.3 mm x 76.2 mm x 1. 6 mmt glass-epoxy pcb based on jedec. if ta R 25 c, reduce by 6.0 mw/c. (1-layer pcb: copper foil area on the reverse side of pcb: 0 mm x 0 mm) to252-3 mounted on 114.3 mm x 76.2 mm x 1.6 mmt glass-epoxy pcb based on jedec. if ta R 25 c, reduce by 10.4 mw/c. (1-layer pcb: copper foil area on the reverse side of pcb: 0 mm x 0 mm) to263-3f mounted on 114.3 mm x 76.2 mm x 1.6 mmt glass-epoxy pcb based on jedec. if ta R 25 c, reduce by 15.3mw/c. (1-layer pcb: copper foil area on the reverse side of pcb:0 mm x 0 mm) sot223-4f mounted on 114.3 mm x 76.2 mm x 1.6 mm t glass-epoxy pcb based on jedec. if ta R 25 c, reduce by 4.8 mw/c. (1-layer pcb: copper foil area on the reverse side of pcb: 0 mm x 0 mm) operating conditions -40 < ta < +125c bd733l2efj/fp/fp2/fp3-c parameter symbol min. max. unit supply voltage *3 vcc 4.37 45.0 v startup voltage *4 vcc 3.0 - v output current iout 0 200 ma bd750l2efj/fp/fp2/fp3-c parameter symbol min. max. unit supply voltage *3 vcc 5.8 45.0 v startup voltage *4 vcc 3.0 - v output current iout 0 200 ma *3 for output voltage, refer to the dropout voltage corresponding to the output current. *4 when iout=0ma.
datasheet datasheet . 6/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 thermal resistance *5 htsop-j8 mounted on 114. 3 mm x 76.2 mm x 1.6 mmt glass-epoxy pcb based on jedec. (4-layer pcb: copper foil on the reve rse side of pcb: 74 .2 mm x 74.2 mm) *6 to252-3 mounted on 114.3 mm x 76.2 mm x 1.6 mmt glass-epoxy pcb based on jedec. (4-layer pcb: copper foil on the reve rse side of pcb: 74 .2 mm x 74.2 mm) *7 to263-3f mounted on 114.3 mm x 76.2 mm x 1.6 mmt glass-epoxy pcb based on jedec. (4-layer pcb: copper foil on the reve rse side of pcb: 74 .2 mm x 74.2 mm) *8 sot223-4f mounted on 114.3 mm x 76.2 mm x 1.6 mmt glass-epoxy pcb based on jedec. (4-layer pcb: copper foil on the reve rse side of pcb: 74 .2 mm x 74.2 mm) parameter symbol min. max. unit htsop-j8 package junction to ambient *5 ja 43.1 c/w junction to case (bottom) *5 jc 10 c/w to252-3 package junction to ambient *6 ja 24.5 c/w junction to case (bottom) *6 jc 3 c/w to263-3f package junction to ambient *7 ja 15.6 c/w junction to case (bottom) *7 jc 3 c/w sot223-4f package junction to ambient *8 ja 83.3 c/w junction to case (bottom) *8 jc 17 c/w
datasheet datasheet . 7/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 electrical characteristics (bd733l2efj/fp/fp2/fp3-c) (unless otherwise specified, -40 < ta < +125c, vcc=13.5v, iout=0ma, reference value: ta=25c ) parameter symbol limit unit conditions min. typ. max. bias current ib - 6 15 a output voltage vout 3.23 3.30 3.37 v 8v < vcc < 16v 0ma < iout < 100ma dropout voltage vd - 0.6 1.0 v vcc=vout0.95, iout=200ma ripple rejection r.r. 50 63 - db f=120hz, ein=1vrms, iout=100ma line regulation reg i - 5 20 mv 8v < vcc < 16v load regulation reg l - 5 20 mv 10ma < iout < 200ma electrical characteristics (bd750l2efj/fp/fp2/fp3-c) (unless otherwise specified, -40 < ta < +125c, vcc=13.5v, iout=0ma, reference value: ta=25c ) parameter symbol limit unit conditions min. typ. max. bias current ib - 6 15 a output voltage vout 4.9 5.0 5.1 v 8v < vcc < 16v 0ma < iout < 100ma dropout voltage vd - 0.4 0.7 v vcc=vout0.95, iout=200ma ripple rejection r.r. 50 60 - db f=120hz, ein=1vrms, iout=100ma line regulation reg i - 5 20 mv 8v < vcc < 16v load regulation reg l - 5 20 mv 10ma < iout < 200ma
datasheet datasheet . 8/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 typical performance curves bd733l2efj/fp/fp2/fp3-c reference data unless otherwise specified: -40 < ta < +125c, vcc=13.5v, iout=0ma figure 5. bias current figure 8. output voltage vs. load figure 6. output voltage vs. supply voltage iout=10ma figure 7. output voltage vs. supply voltage iout=100ma 0 1 2 3 4 5 6 0 1020304050 su ppl y vol tage : vc c [v] output voltage : vout[v ] 0 1 2 3 4 5 6 0 1020304050 supply voltage : vcc[v] output voltage : vout[v ] 0 1 2 3 4 5 6 0 200 400 600 800 1000 output current : iout[m a] output voltage : vout[v ] -40c 25c 125c -40c 25c 125c -40c 25c 125c 0 10 20 30 40 50 60 70 80 90 100 0 1020304050 su ppl y vol tage : vc c [v] bias current : lb[ a] -40 25 125
datasheet datasheet . 9/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 bd733l2efj/fp/fp2/fp3-c reference data unless otherwise specified: -40 < ta < +125c, vcc=13.5v, iout=0ma 0 1 2 3 4 5 6 100 120 140 160 180 200 ambient temperature : ta[ ] output voltage : vout[v ] figure 9. dropout voltage figure 11. total supply current vs. load figure 12. thermal shutdown figure 10. ripple rejection (ein=1vrms,iout=100ma) 0.0 0.4 0.8 1.2 0 40 80 120 160 200 output current : iout[m a] dropout : vd[v] 0 10 20 30 40 50 60 70 80 90 10 100 1000 10000 100000 frequency : f[hz] ripple rejection : r.r.[db] -40c 25c 125c -40c 25c 125c 0 2 4 6 8 10 12 14 16 18 20 0 40 80 120 160 200 output current : iout[ma] bias current : lb[ a] -40 25 125
datasheet datasheet . 10/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 bd733l2efj/fp/fp2/fp3-c reference data unless otherwise specified: -40 < ta < +125c, vcc=13.5v, iout=0ma figure 13. output voltage vs. temperature fi gure 14. quiescent current vs. temperature 3.280 3.285 3.290 3.295 3.300 3.305 3.310 3.315 -40 0 40 80 120 ambient temperature : ta[ ] output voltage : vout[v ] 4 5 6 7 8 9 10 -40 0 40 80 120 ambient temperature : ta[ ] bias current : lb[ a]
datasheet datasheet . 11/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 bd750l2efj/fp/fp2/fp3-c reference data unless otherwise specified: -40 < ta < +125c, vcc=13.5v, iout=0ma figure 15. bias current figure 16. output voltage vs. supply voltage figure 17. output voltage vs. supply voltage iout=100ma figure 18. output voltage vs. load 0 1 2 3 4 5 6 7 8 0 1020304050 supply voltage : vcc[v] output voltage : vout[v ] 0 1 2 3 4 5 6 7 8 0 200 400 600 800 1000 output current : iout[m a] output voltage : vout[v ] -40c 25c 125c -40c 25c 125c 0 1 2 3 4 5 6 7 8 0 1020304050 supply voltage : vcc[v] output voltage : vout[v] -40c 25c 125c 0 10 20 30 40 50 60 70 80 90 100 0 1020304050 su ppl y vol tage : vc c [v] bias current : lb[ a] . -40 25 125
datasheet datasheet . 12/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 bd750l2efj/fp/fp2/fp3-c reference data unless otherwise specified: -40 < ta < +125c, vcc=13.5v, iout=0ma 0 10 20 30 40 50 60 70 80 90 10 100 1000 10000 100000 frequency : f[hz] ripple rejection : r.r.[db] 0 1 2 3 4 5 6 100 120 140 160 180 200 ambient temperature : ta[ ] output voltage : vout[v ] figure 20. ripple rejection (ein=1vrms,iout=100ma) figure 21. total supply current vs. load figure 22. thermal shutdown figure 19. dropout voltage -40c 25c 125c 0.0 0.4 0.8 1.2 0 40 80 120 160 200 output current : iout[ma] dropout voltage : vd[v] -40c 25c 125c 0 2 4 6 8 10 12 14 16 18 20 0 40 80 120 160 200 output current : iout[m a] bias current : lb[ a] . -40 25 125
datasheet datasheet . 13/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 bd750l2efj/fp/fp2/fp3-c reference data unless otherwise specified: -40 < ta < +125c, vcc=13.5v, iout=0ma figure 23. output voltage vs. temperature figure 24. bias current vs. temperature 4.970 4.975 4.980 4.985 4.990 4.995 5.000 5.005 5.010 5.015 5.020 -40 0 40 80 120 ambient temperature : ta[ ] output voltage : vout[v ] 4 5 6 7 8 9 10 -4004080120 ambient temperature : ta[ ] bias current : lb[ a]
datasheet datasheet . 14/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 reference data (bd7xxl2efj-c series) htsop-j8 reference data (bd7xxl2fp-c series) to252-3 measurement setup for figure 5, 14, 15, 24 measurement setup for figure 6, 7, 12, 13, 16, 17, 22, 23 measurement setup for figure 8, 18 measurement setup for figure 9, 19 measurement setup for figure 10, 20 measurement setup for figure 11, 21 measurement setup for figure 5, 14, 15, 24 measurement setup for figure 6, 7, 12, 13, 16, 17, 22, 23 measurement setup for figure 8, 18 measurement setup for figure 9, 19 measurement setup for figure 10, 20 measurement setup for figure 11, 21 bd7xxl2efj-c 8:vcc 7:n.c. 6:n.c. 5:gnd 1:vout 2:n.c. 3:n.c. 4:n.c. 1f 4.7f 1vrms iout bd7xxl2efj-c 8:vcc 7:n.c. 6:n.c. 5:gnd 1:vout 2:n.c. 3:n.c. 4:n.c. 1f 4.7f bd7xxl2efj-c 8:vcc 7:n.c. 6:n.c. 5:gnd 1:vout 2:n.c. 3:n.c. 4:n.c. 1f 4.7f iout
datasheet datasheet . 15/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 reference data (bd7xxl2fp2-c series) to263-3f reference data (bd7xxl2fp3-c series) sot223-4f measurement setup for figure 5, 14, 15, 24 measurement setup for figure 6, 7, 12, 13, 16, 17, 22, 23 measurement setup for figure 8, 18 measurement setup for figure 9, 19 measurement setup for figure 10, 20 measurement setup for figure 11, 21 measurement setup for figure 5, 14, 15, 24 measurement setup for figure 6, 7, 12, 13, 16, 17, 22, 23 measurement setup for figure 8, 18 measurement setup for figure 9, 19 measurement setup for figure 10, 20 measurement setup for figure 11, 21
datasheet datasheet . 16/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 selection of components externally connected ? vcc pin insert capacitors with a capacitance of 0.1 f or higher between the vcc and gnd pin. choose the capacitance according to the line between the power smoothing circuit and the vcc pin. selection of the capacitance also depends on the application. verify the application and allow for sufficient margins in the design. we recommend using a capacitor with excellent voltage and temperature characteristics. ? output pin capacitor in order to prevent oscillation, a capacitor needs to be placed between the output pin and gnd pin. we recommend using a capacitor with a capacitance of 4.7 f or higher. electrolytic, tantalum and ceramic capacitors can be used. when selecting the capacitor ensur e that the capacitance of 4.7 f or higher is maintained at the intended applied voltage and temperature range. due to changes in temper ature the capacitor?s capacitance can fluctuate possibly resulting in oscillation. for selection of the capacitor refer to the iout vs. esr data. the stable operation range given in the reference data is based on the standalone ic and resistive load. for act ual applications the stable operating range is influenced by the pcb impedance, input supply impedance and load impedance. therefore verification of the final operating environment is needed. when selecting a ceramic type capacitor, we recommend usi ng x5r, x7r or better with excellent temperature and dc-biasing characteristics and high voltage tolerance. also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying that the actual applicat ion meets with the required specification. measurement setup condition vcc=13.5v cin=0.1 f 4.7f < cout < 22f ta=-40 < ta < +125 condition vcc=13.5v cin=0.1f 4.7f < cout < 100f ta=-40 < ta < +125 to263-3f sot223-4f htsop-j8 bd7xxl2efj-c 8:vcc 7:n.c. 6:n.c. 5:gnd 1:vout 2:n.c. 3:n.c. 4:n.c. cin iout cout esr to252-3
datasheet datasheet . 17/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 5.1 w 1.3 w 0 1 2 3 4 5 6 0 255075100125150 power dissipation: pd[w] ambient temperature: ta[c] power dissipation htsop-j8 ic mounted on rohm standard board based on jedec. board material: fr4 board size: 114.3 mm 76.2 mm 1.6 mmt (with thermal via on the board) mount condition: pcb and exposed pad are soldered. top copper foil: the footprint rohm recommend. + wiring to measure. : 1-layer pcb (copper foil area on the reverse side of pcb: 0 mm 0 mm) : 4-layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2 mm 74.2 mm) condition : ja = 166.7 c/w, jc(top) = 45 c/w condition : ja = 43.1 c/w, jc(top) = 16 c/w, jc(bottom) = 10 c/w to252-3 ic mounted on rohm standard board based on jedec. board material: fr4 board size: 114.3 mm 76.2 mm 1.6 mmt (with thermal via on the board) mount condition: pcb and exposed pad are soldered. top copper foil: the footprint rohm recommend. + wiring to measure. : 1-layer pcb (copper foil area on the reverse side of pcb: 0 mm 0 mm) : 4-layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2mm 74.2 mm) condition : ja = 96.2 c/w, jc(top) = 22 c/w condition : ja = 24.5 c/w, jc(top) = 5 c/w, jc(bottom) = 3 c/w 0 1 2 3 4 5 0 255075100125150 power dissipation: pd[w] ambient temperature: ta[ ? ] 0.75 w 2.9 w figure 25. package data (htsop-j8) figure 26. package data (to252-3)
datasheet datasheet . 18/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 8.0 w 1.9 w 0 2 4 6 8 10 0 255075100125150 power dissipation: pd[w] ambient temperature: ta[c] to263-3f ic mounted on rohm standard board based on jedec. board material: fr4 board size: 114.3 mm 76.2 mm 1.6 mmt (with thermal via on the board) mount condition: pcb and exposed pad are soldered. top copper foil: the footprint rohm recommend. + wiring to measure. : 1-layer pcb (copper foil area on the reverse side of pcb: 0 mm 0 mm) : 4-layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2mm 74.2 mm) condition : ja = 65.2 c/w, jc(top) = 19 c/w condition : ja = 15.6 c/w, jc(top) = 16 c/w, jc(bottom) = 3 c/w sot223-4f ic mounted on rohm standard board based on jedec. board material: fr4 board size: 114.3 mm 76.2 mm 1.6 mmt (with thermal via on the board) mount condition: pcb and exposed pad are soldered. top copper foil: the footprint rohm recommend. + wiring to measure. : 1-layer pcb (copper foil area on the reverse side of pcb: 0 mm 0 mm) : 4-layer pcb (2 inner layers and copper foil area on the reverse side of pcb: 74.2mm 74.2 mm) condition : ja = 208.3 c/w, jc(top) = 52 c/w condition : ja = 83.3 c/w, jc(top) = 36 c/w, jc(bottom) = 17 c/w 1.5 w 0.6 w 0 1 2 3 4 5 0 255075100125150 power dissipation: pd[w] ambient temperature: ta[c] figure 27. package data (to263-3f) figure 28. package data (sot223-4f)
datasheet datasheet . 19/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 refer to the heat mitigation characterist ics illustrated in figure 25 to figure 28 when using the ic in an environment of t a R 25c. the characteristics of the ic are greatly influenced by the operating temperature, and it is necessary to operate under the maximum junction temperature timax. even if the ambient temperature ta is at 25c it is possible that the junction temperature tj reaches high temperatures. therefore, the ic should be operated within the power dissipation range. the following method is used to calculate the power consumption pc (w) pc=(vcc vout)iout vccib power dissipation pd R pc the load current lo is obtained by operating the ic within the power dissipation range. (refer to figure 11 and figure 21 for the ib) thus, the maximum load current ioutmax for the applied voltage vcc can be calculated during the thermal design process. htsop-j8 calculation example 1) with ta=125c, vcc=13.5v, vout=3.3v at ta=125c with figure 25 condition, the calculation shows that ca 56.4ma of out put current is possibl e at 10.2v potential difference across input and output. calculation example 2) with ta=125c, vcc=13.5v, vout=5.0v at ta=125c with figure 25 condition, the calculation shows that ca 67.7ma of out put current is possible at 8.5v potential difference across input and output. the thermal calculation shown above should be taken into consid eration during the thermal design in order to keep the whole operating temperature range within the power dissipation range. in the event of shorting (i.e. vout and g nd pins are shorted) the power consumption pc of the ic can be calculated as follows: pc=vcc(ib+ishort) (refer to figure 8 and figure 18 for the ishort) vcc : input voltage vout : output voltage iout : load current ib : bias current ishort : shorted current iout Q56.4ma (ib: 6a) 0.576 13.5ib 10.2 iout Q iout Q67.7ma (ib: 6a) 0.576 13.5ib 8.5 iout Q ja=43.1c/w -23.2mw/c 25c=2.90w 125c=0.576w ja=43.1c/w -23.2mw/c 25c=2.90w 125c=0.576w iout Q pd vccib vccvout
datasheet datasheet . 20/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 to252-3 calculation example 3) with ta=125c, vcc=13.5v, vout=3.3v at ta=125c with figure 26 condition, the calculation show s that ca 100ma of output current is possible at 10.2v potential difference across input and output. calculation example 4) with ta=125c, vcc=13.5v, vout=5.0v at ta=125c with figure 26 condition, the calculation shows that ca 120ma of output current is po ssible at 8.5v potential difference across input and output. the thermal calculation shown above should be taken into consid eration during the thermal design in order to keep the whole operating temperature range within the power dissipation range. in the event of shorting (i.e. vout and g nd pins are shorted) the power consumption pc of the ic can be calculated as follows: pc=vcc(ib+ishort) (refer to figure 8 and figure 18 for the ishort) iout Q100ma (ib: 6a) iout Q 1.02 13.5 ib 10.2 ja=24.5c/w -40.8mw/c 25c=5.10w 125c=1.02w iout Q120ma (ib: 6a) iout Q 1.02 13.5ib 8.5 ja=24.5c/w -40.8mw/c 25c=5.10w 125c=1.02w
datasheet datasheet . 21/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 to263-3f calculation example 5) with ta=125c, vcc=13.5v, vout=3.3v at ta=125c with figure 27 condition, the calculation show s that ca 156ma of output current is possible at 10.2v potential difference across input and output. calculation example 6) with ta=125c, vcc=13.5v, vout=5.0v at ta=125c with figure 27 condition, the calculation shows that ca 187ma of output current is po ssible at 8.5v potential difference across input and output. the thermal calculation shown above should be taken into consid eration during the thermal design in order to keep the whole operating temperature range within the power dissipation range. in the event of shorting (i.e. vout and g nd pins are shorted) the power consumption pc of the ic can be calculated as follows: pc=vcc(ib+ishort) (refer to figure 8 and figure 18 for the ishort) iout Q187ma (ib: 6a) iout Q 1.59 13.5ib 8.5 iout Q156ma (ib: 6a) iout Q 1.59 13.5ib 10.2 ja=15.6c/w -64.1mw/c 25c=8.00w 125c=1.59w ja=15.6c/w -64.1mw/c 25c=8.00w 125c=1.59w
datasheet datasheet . 22/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 sot223-4f calculation example 7) with ta=125c, vcc=13.5v, vout=3.3v at ta=125c with figure 28 condition, the calculation shows that ca 29.4ma of out put current is possibl e at 10.2v potential difference across input and output. calculation example 8) with ta=125c, vcc=13.5v, vout=5.0v at ta=125c with figure 28 condition, the calculation shows that ca 35.2ma of out put current is possible at 8.5v potential difference across input and output. the thermal calculation shown above should be taken into consid eration during the thermal design in order to keep the whole operating temperature range within the power dissipation range. in the event of shorting (i.e. vout and g nd pins are shorted) the power consumption pc of the ic can be calculated as follows: pc=vcc(ib+ishort) (refer to figure 8 and figure 18 for the ishort) iout Q29.4ma (ib: 6a) iout Q 0.30 13.5ib 10.2 iout Q35.2ma (ib: 6a) iout Q 0.30 13.5ib 8.5 ja=83.3c/w -12.0mw/c 25c=1.50w 125c=0.30w ja=83.3c/w -12.0mw/c 25c=1.50w 125c=0.30w
datasheet datasheet . 23/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 application examples ? applying positive surge to the vcc pin if the possibility exists that surges higher than 50v will be applied to the vcc pin, a zenar diode should be placed between the vcc pin and gnd pin as shown in the figure below. ? applying negative surge to the vcc pin if the possibility exists that negative surges lower than th e gnd are applied to the vcc pin, a shottky diode should be place between the vcc pin and gnd pin as shown in the figure below. ? implementing a protection diode if the possibility exists that a large inducti ve load is connected to the output pin re sulting in back-emf at time of startup and shutdown, a protection diode should be placed as shown in the figure below. i/o equivalence circuits output terminal *inside of () shows 5v input terminal vout to263-3f sot223-4f htsop-j8 fin 1:vcc 2:gnd 3:vout bd7xxl2fp2-c cin cout iout fin 1:vcc 2:gnd 3:vout bd7xxl2fp2-c cin cout iout to263-3f sot223-4f htsop-j8 to252-3 to252-3
datasheet datasheet . 24/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 operational notes 1) absolute maximum ratings exceeding the absolute maximum rating for supply voltage, operating te mperature or other parameters can result in damages to or destruction of the chip. in this event it also becomes impossible to det ermine the cause of the damage (e.g. short circuit, open circuit, etc.). therefore, if any specia l mode is being considered with values expected to exceed the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered. 2) the electrical characteristics given in this specification may be influenced by conditions such as temperature, supply voltage and external components. transient characteristics should be sufficiently verified. 3) gnd electric potential keep the gnd pin potentia l at the lowest (minimum) level under any oper ating condition. furthermore, ensure that, including the transient, none of the pin?s vo ltages are less than the gnd pin voltage. 4) gnd wiring pattern when both a small-signal gnd and a high curr ent gnd are present, single-point gr ounding (at the set standard point) is recommended. this in order to separate the small-signal and high current patterns and to ensure that voltage changes stemming from the wiring resistance and high current do not caus e any voltage change in the small-signal gnd. similarly, care must be taken to avoid wiring pattern fluct uations in any connected external component gnd. 5) inter-pin shorting and mounting errors ensure that when mounting the ic on the pcb the direction and position are correct. incorrect mounting may result in damaging the ic. also, shorts caused by dust entering betw een the output, input and gnd pin may result in damaging the ic. 6) inspection using the set board the ic needs to be discharged after each inspection process as, while using the set board for inspection, connecting a capacitor to a low-impedance pin may cause stress to the ic. as a protection from static electricity, ensure that the assembly setup is grounded and take sufficient caution with tr ansportation and storage. also, make sure to turn off the power supply when connecting and disconnecting the inspection equipment. 7) power dissipation (pd) should by any chance the power dissipation rating be exceed ed the rise in temperature of the chip may result in deterioration of the properties of the ch ip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 8) thermal design the power dissipation under actual oper ating conditions should be taken into consideration and a sufficient margin should be allowed for in the thermal design. on the reverse side of the package this product has an exposed heat pad for improving the heat dissipation. use both the front and reverse side of the pcb to increase the heat dissipation pattern as far as possible. the amount of heat generated depends on the voltage difference across the input and output, load current, and bias current. therefore, when actually using the chip, ensure that the gener ated heat does not exceed the pd rating. tjmax: maximum junction temperature= 150c, ta: ambient temperature (c), ja: junction-to-ambient thermal resistance (c/w), pd: power dissipation rating (w), pc : power consumption (w), vcc: input voltage, vout: output voltage, iout: load current, ib: bias current power dissipation rating pd (w)=(tjmax ta ) / ja power consumption pc (w)=(vcc-vout)iout vccib 9) rapid variation in vcc voltage and load current in case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a mosfet as output transistor. although the actual appl ication might be the cause of the transients, the ic input voltage, output current and temperature are also possible causes. in case problems arise within the actual operating range, use countermeasures such as adjusting the output capacitance.
datasheet datasheet . 25/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 10) minute variation in output voltage in case of using an application susceptib le to minute changes to the output vo ltage due to noise, changes in input and load current, etc., use countermeasures such as implementing filters. 11) overcurrent protection circuit this ic incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 12) thermal shutdown (tsd) this ic incorporates and integrated thermal shutdown circui t to prevent heat damage to the ic. normal operation should be within the power dissipation rating, if however the rating is exceeded for a continued pe riod, the junction temperature (tj) will rise and the tsd circuit will be activated and turn all output pins off. after the tj falls below the tsd threshold the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than pr otecting the ic from heat damage. 13) in some applications, the vcc and pin potential might be re versed, possibly resulting in circuit internal damage or damage to the elements. for example, while the external ca pacitor is charged, the vcc shorts to the gnd. use a capacitor with a capacitance with less than 1000 f. we also recommend using reverse polarity diodes in series or a bypass between all pins and the vcc pin. 14) this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p/n junctions are formed at the intersection of these p layers with t he n layers of other elements to create a variety of parasitic elements. for example, in case a resistor and a transistor are connected to the pins as shown in the figure below then: the p/n junction functions as a parasitic diode when gnd > pi n a for the resistor, or gnd > pin b for the transistor. also, when gnd > pin b for the transistor (npn), the parasi tic diode described above combines with the n layer of the other adjacent elements to operate as a parasitic npn transistor. parasitic diodes inevitably occur in the structure of the ic. their operation can result in mutual interference between circuits and can cause malfunctions and, in turn, physical dam age to or destruction of the chip. therefore do not employ any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than the (p substrate) gnd. figure 29. example of the parasitic device structures
datasheet datasheet . 26/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 physical dimension, tape and reel information package name htsop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
datasheet datasheet . 27/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 physical dimension, tape and reel information package name to252-3 direction of feed 1pin reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the lower left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 ( )
datasheet datasheet . 28/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 physical dimension, tape and reel information package name to263-3f direction of feed
datasheet datasheet . 29/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 physical dimension, tape and reel information package name sot223-4f direction of feed
datasheet datasheet . 30/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 marking diagrams (top view) part number marking output voltage (v) bd733l2 3.3 bd750l2 5.0 to252-3 htsop-j8 htsop-j8 (top view) part number marking lot number 1pin mark to252-3 (top view) part number marking lot number sot223-4f (top view) part number marking lot number 1pin sot223-4f to263-3f to263-3f (top view) part numbe r marking lot numbe r 1pin
datasheet datasheet . 31/31 tsz02201-0t2t0an00010-1-2 ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 www.rohm.com bd7xxl2efj/fp/fp2/fp3-c 14.mar.2013 rev.003 revision history date revision changes 21.aug.2012 001 new release 24.sep.2012 002 new release to252-3 package. 14.mar.2013 003 page 1.series name is changed. page 6. append thermal resistance ja, jc. page 8. figure 5, page 9. figure 11 all quiesc ent current are integrated into bias current. page 10. figure 14, page 11. figure 15 all quiescent current are integrated into bias current. page 12. figure 21, page 13. figure 24 all quiesce nt current are integrated into bias current. page 17, 18. figure 25, 26, 27, 28 power dissipation is changed to be compliant with jedec standard. page 19, 20. calculation examples are changed. page 25. ?application example? is deleted. figure 29 ? example of the pa rasitic device structures? is renewed.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1. before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2. all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1. if you intend to use our products in devices requirin g extremely high reliability (such as medical equipment, aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1. the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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